Resume

Vertically Integrated Projects — Interacting with Sound and Space (L42i)

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Undergraduate Researcher — BONG Sub-team · Georgia Institute of Technology · Jan 2026 – Present

• Contributing to the Mk. III iteration of BONG, a digital brass-inspired instrument developed at the Lab for Interaction and Immersion (L42i), transforming it from a controller interface into a self-contained instrument with onboard synthesis, amplification, and spatial interaction capabilities
• Designed PCB schematic modifications in EasyEDA, including replacing the analog potentiometer with a rotary encoder and routing corrective wiring for the microphone amplifier stage
• Prototyped speaker bell enclosures via FDM 3D printing and prepared DXF files for laser-cut stacked-ring plywood fabrication as an alternative manufacturing path
• Co-authoring a semester paper documenting PCB design practices, bell acoustics research, and manufacturing workflows

Yellow Jacket Space Program — Avionics Department

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Avionics Hardware Designer · Georgia Institute of Technology · Aug 2025 – Present

• Implemented a 2-layer avionics PCB onboarding project using Altium Designer, integrated STM32H573 MCU with ADS114S06 ADC for four-wire PT100 RTD temperature measurement
• Entered Hardware-in-the-Loop (HITL) department as an avionics member.
• Implemented power regulation (24 V input, Buck converter, LDO), relay driving, INA228 current monitoring, and PCF8575 GPIO expansion
• Iterated schematic and layout through team design reviews; transplanted components for Altium library integration and compatibility

Shanghai Huatai Automation Co., Ltd

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Student Intern — Mechanical & Electrical Design · Shanghai, China · Jul 2025

• Developed an imitation learning gripper that provided innovative solutions for traditional manufacturing processes
• Designed end joint control using LCEDA; completed both “pluck wheel” and “two-stage button” configurations
• Modified mechanical structure in Fusion 360 to accommodate electrical components and improve manual compatibility
• Designed a modular, lightweight camera bracket for the gripper head in Fusion 360
• Manufactured parts via 3D printing and assembled components, ensuring precise fit of screws, bearings, and printed parts

Ningbo University — Intelligent Wireless Technology Lab

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Intern Researcher · Ningbo, China · Jul 2024 – Aug 2024

• Designed and fabricated substrate-integrated waveguide (SIW) microwave miniature filters with high Q-factor, low insertion loss
• Built prototypes on FR4 and Rogers substrates, modeled in Fusion 360, and optimized using Ansys HFSS simulations
• Validated experimental performance with a vector network analyzer; measured data closely matched simulation results