[{"content":"","date":"May 1, 2026","externalUrl":null,"permalink":"/tags/altium-designer/","section":"Tags","summary":"","title":"Altium Designer","type":"tags"},{"content":"","date":"May 1, 2026","externalUrl":null,"permalink":"/tags/ece/","section":"Tags","summary":"","title":"ECE","type":"tags"},{"content":"","date":"May 1, 2026","externalUrl":null,"permalink":"/tags/embedded-systems/","section":"Tags","summary":"","title":"Embedded Systems","type":"tags"},{"content":"","date":"May 1, 2026","externalUrl":null,"permalink":"/tags/hardware/","section":"Tags","summary":"","title":"Hardware","type":"tags"},{"content":" About # Welcome! This is the career portfolio of Hongyi Lyu, featuring recent updates, projects, and professional experience.\nResume\rEmail\rGitHub\rLinkedIn\r","date":"May 1, 2026","externalUrl":null,"permalink":"/","section":"Homepage","summary":"About # Welcome! This is the career portfolio of Hongyi Lyu, featuring recent updates, projects, and professional experience.\n","title":"Homepage","type":"page"},{"content":"","date":"May 1, 2026","externalUrl":null,"permalink":"/tags/pcb-design/","section":"Tags","summary":"","title":"PCB Design","type":"tags"},{"content":"","date":"2026年5月1日","externalUrl":null,"permalink":"/zh/tags/pcb-%E8%AE%BE%E8%AE%A1/","section":"Tags","summary":"","title":"PCB 设计","type":"tags"},{"content":" Projects I have worked on. ","date":"May 1, 2026","externalUrl":null,"permalink":"/projects/","section":"Projects","summary":" Projects I have worked on. ","title":"Projects","type":"projects"},{"content":"","date":"May 1, 2026","externalUrl":null,"permalink":"/tags/","section":"Tags","summary":"","title":"Tags","type":"tags"},{"content":" Design of STM32 Dual Channel High Precision RTD Temperature Acquisition system for rocket hardware-in-the-loop (HITL) testing. Overview # This project is part of the Yellow Jacket Space Program (YJSP) Avionics Department onboarding program. The goal is to design a 2-layer rapid test board that integrates an STM32H573 microcontroller with an ADS114S06 high-precision ADC for four-wire PT100 RTD temperature measurement, along with a complete power regulation chain from a 24V input.\nThe board serves as a training platform for avionics PCB design skills using Altium Designer and Altium 365, and as a stepping stone into the Hardware-in-the-Loop (HITL) department.\nSystem Architecture # The design uses a hierarchical schematic structure in Altium Designer, organized into four sheets managed by a top-level sheet:\nPower (Power.SchDoc) — 24V input with fuse-based overcurrent protection, TVS diode clamping for ESD and overvoltage/reverse polarity protection, GND-to-CGND noise discharge network, and a MAX17503 step-down DC-DC converter providing 3.3V (main rail) and 5V LDO (analog supply). Power-good LED indicators for both 24V and 3.3V rails.\nMCU (MCU.SchDoc) — STM32H573RIT6 (ARM Cortex-M33, 250 MHz) with full decoupling network (six 100nF caps on VDD/VSS, 10nF on VDDA, 2.2µF on VCAP), 32 MHz external oscillator (TG2520SMN32.0000M-MCGNNM3), JTAG debug interface via FTSH-107-01-F-DV-K-P-TR 14-pin connector, and SPI bus with series resistors (47Ω) for signal integrity on CS, MOSI, SCLK, ECLK, MISO, and DRDY lines.\nADC (ADC.SchDoc) — ADS114S06IPBS 16-bit delta-sigma ADC with dual power domains (3.3V digital via IOVDD/DVDD, 5V LDO analog via AVDD), separate AGND plane, two four-wire RTD front-end circuits with RC filtering (1kΩ + 10nF/100nF) on each analog input, and a 0Ω resistor (R30) bridging AGND to GND.\nConnectors (Connectors.SchDoc) — MOLEX 430450400 4-pin connectors for 24V power input (J1), RTD Channel A (J2), and RTD Channel B (J3). Each RTD connector breaks out IDAC, IDACRTN, RTD_P, and RTD_N signals.\nPower Design # Input Protection # The 24V input enters through a BEL 0ZCG0150BF2C fuse (F1) for overcurrent protection, then passes through two TVS diodes that serve dual purposes:\nD1 (SMAJ26A) — Clamped across the 24V input to GND. Provides overvoltage clamping and reverse polarity error protection. If the input voltage exceeds the breakdown threshold or is applied in reverse, D1 clamps the voltage and the fuse blows, protecting downstream circuitry.\nD4 (SMAJ5.0A) — Clamped across the 3V3 rail to GND. Provides ESD protection and overvoltage/reverse polarity error protection specifically for the 3.3V power domain.\nGrounding and Noise Discharge # A grounding network provides static electricity discharge and high-frequency noise filtering between the power ground (GND) and chassis ground (CGND):\nR1 (1MΩ) — Connects GND to CGND, providing a controlled path for static electricity discharge while maintaining isolation between the two ground domains at DC.\nC2 (4.7nF) — In parallel with R1, provides a low-impedance path for high-frequency noise between GND and CGND, shunting transient energy to the chassis.\nBuck Converter (24V → 3.3V) # The Maxim MAX17503 step-down DC-DC converter directly converts the 24V input to 3.3V output. The schematic follows the datasheet reference design. Key components:\nInput stage — C3 (2.2µF, 50V) provides input decoupling. The EN/UVLO pin sets the input undervoltage lockout threshold. A 5V LDO output from pin 12 (VCC) powers the internal gate driver and control logic, with C4 (2.2µF) as the bypass capacitor.\nOutput stage — L1 (XGL3530-682MEC, 6.8µH) is the power inductor connected to the Lx switching output (pins 17–19). C7 (47µF) is the bulk output capacitor. The output voltage is set to 3.3V by the feedback resistor divider formed by R4 (100kΩ) and R5 (37.4kΩ) on the FB pin.\nAuxiliary — C6 (100nF, 50V) is the bootstrap capacitor on the BST pin, required for high-side MOSFET gate drive. C5 (10nF) on the SS pin sets the soft-start ramp time, limiting inrush current at power-up. The RT pin is left unconnected (using the internal default switching frequency). The CF pin capacitor sets the compensation for loop stability.\nPower Good Indicators # Two LEDs provide visual power status indication: D2 (red) lights when 24V input is present, and D3 (green) lights when the 3.3V output is active. R2 (2.2kΩ) and R3 (100Ω) are the respective current-limiting resistors.\nMCU: STM32H573RIT6 # Power and Decoupling # The MCU power network follows the datasheet recommendations with careful attention to each supply domain. Every VDD pin (pins 19, 32, 48, 64) is bypassed with a 100nF ceramic capacitor (C8–C10, C13) placed as close as possible to the pin. The VDDA analog supply (pin 13) receives additional filtering with both a 100nF cap (C11) and a 10nF cap (C14) to suppress high-frequency noise coupling into the internal ADC reference. The VCAP pins (pins 30, 62) require 2.2µF capacitors (C15, C16) for the internal voltage regulator. VBAT (pin 1) is connected to 3.3V through R6 (100Ω) with C12 (100nF) for backup domain filtering. The MCU_PWR net label is annotated to remind that every port requires its own 100nF decoupling cap and that VDDA benefits from additional 10nF filtering.\nClock Source # An external 32 MHz crystal oscillator (TG2520SMN32.0000M-MCGNNM3, designated Y1) provides the system clock, connected to PH0-OSC_IN (pin 5) and PH1-OSC_OUT (pin 6). The oscillator is powered from 3.3V (VCC, pin 3) with C18 (100nF) as a bypass capacitor. An additional secondary 32 kHz oscillator input is available on PC14-OSC32_IN (pin 3) and PC15-OSC32_OUT (pin 4) but left unconnected in this design.\nReset and Boot Configuration # The NRST pin (pin 7) is connected to C17 (100nF) to GND for power-on reset filtering. The BOOT0 pin (pin 60) is tied to GND through R7 (10kΩ), ensuring the MCU boots from internal flash under normal operation.\nJTAG Debug Interface # A full JTAG interface is implemented using a FTSH-107-01-F-DV-K-P-TR 14-pin connector (J4), supporting both JTAG and SWD protocols. The JTMS, JTCK, JTDO, JTDI, and NRST signals are routed through 10kΩ series resistors (R8–R11 for signal lines, R9 for NRST) for ESD protection and signal conditioning. C19 (100nF) provides local decoupling for the T_VCC power pin. The connector also includes GND_DETECT for debugger presence sensing and T_VCPRX/T_VCPTX for trace port functionality.\nSPI Bus Interface # The SPI1 bus signals connecting to the ADS114S06 are routed through 47Ω series resistors (R12–R16) for impedance matching and signal integrity. The signal mapping is:\nMCU Net Series Resistor ADC Signal Direction SPI1_NSS R12 (47Ω) CS MCU → ADC SPI1_MOSI R13 (47Ω) MOSI MCU → ADC SPI1_SCK R14 (47Ω) SCLK MCU → ADC ADC_CLK R15 (47Ω) ECLK MCU → ADC SPI1_MISO R16 (47Ω) MISO ADC → MCU ADC_RDY R17 (47Ω) DRDY ADC → MCU The ADC_CLK line provides an external clock source to the ADS114S06, driven from the MCU\u0026rsquo;s PC9 pin (pin 40). Two pull-up resistors R28 and R29 (0Ω, placeholder for value selection) connect the 3.3V rail to the ADC SPI interface for optional pull-up configuration. PD2 (pin 54) is marked as an available spare GPIO.\nADC: ADS114S06IPBS # Power Domains # The ADS114S06 operates with split power domains to isolate digital noise from the sensitive analog front-end. IOVDD (pin 15) and DVDD (pin 16) are powered from the 3.3V digital rail with C1 (100nF, 10% tolerance) as the local bypass capacitor. DGND (pin 14) connects to the digital GND plane. The analog supply AVDD (pin 26) is powered from the MAX17503\u0026rsquo;s 5V LDO output, bypassed by C20 (100nF) and C22 (2.2µF). AVSS (pins 27–28) connects to the dedicated AGND plane, which is bridged to GND through a single-point connection via R30 (0Ω). This star-ground topology prevents digital return currents from flowing through the analog ground plane.\nSPI and Control Interface # The digital interface signals (CS, MOSI, SCLK, MISO, DRDY, ECLK) arrive from the MCU sheet through hierarchical sheet connectors, each pre-conditioned by 47Ω series resistors on the MCU side. The START/SYNC pin (pin 8) is directly tied, and the RESET pin (pin 18) is directly connected for MCU-controlled reset. The DRDY output (pin 13) active-low interrupt, directly active. Pin 12 (DOUT/DRDY) provides multiplexed data output and ready signaling on a single pin.\nReference Configuration # The ADC uses external ratiometric referencing for the RTD measurements. Two independent reference pairs are used for the two RTD channels: REFP1/REFN1 (pins 32/31) for RTD Channel A, and REFP0/REFN0 (pins 30/29) for RTD Channel B. The REFOUT (pin 23) and REFCOM (pin 24) internal reference outputs are bypassed with C21 (2.2µF) but the primary measurement references are derived from the IDAC excitation current flowing through the reference resistors in the RTD front-end circuits.\nAnalog Input Channels and RTD Front-End # Each RTD channel uses a dedicated analog front-end circuit with RC filtering on every signal path to reject high-frequency interference before it reaches the ADC inputs.\nChannel A (RTD_A) uses AIN3/AIN4 for voltage sensing and AIN5 for IDAC excitation, with REFP1/REFN1 as the reference pair:\nSignal ADC Pin Filter Function RTD_P → AIN3 pin 4 R18 (1kΩ) + C24 (10nF) + C25 (100nF) Positive voltage sense RTD_N → AIN4 pin 3 R19 (1kΩ) + C23 (10nF) Negative voltage sense IDAC → AIN5 pin 2 — Excitation current output IDACRTN → REFP1 R21 (1kΩ) + C27 (10nF) Excitation current return / Reference+ AGND → REFN1 R22 (1kΩ) + C26 (100nF) + C28 (10nF) Reference− Channel B (RTD_B) uses AIN0/AIN1 for voltage sensing and AIN2 for IDAC excitation, with REFP0/REFN0 as the reference pair:\nSignal ADC Pin Filter Function RTD_P → AIN0 pin 7 R24 (1kΩ) + C29 (10nF) + C34 (100nF) Positive voltage sense RTD_N → AIN1 pin 6 R25 (1kΩ) + C30 (10nF) Negative voltage sense IDAC → AIN2 pin 5 — Excitation current output IDACRTN → REFP0 R26 (1kΩ) + C32 (10nF) Excitation current return / Reference+ AGND → REFN0 R27 (1kΩ) + C31 (100nF) + C33 (10nF) Reference− The R20/R23 (1kΩ) resistors in the IDAC return paths limit current and provide additional filtering nodes. All analog ground connections on the front-end circuits connect to AGND, maintaining isolation from the digital GND domain.\nConnectors # Three MOLEX 430450400 4-pin connectors provide the external interfaces:\nJ1 (Power Input) — Receives the 24V supply through the VIN_PRE net from the Power sheet. Pin 1 carries VIN_PRE, pins 2–4 are paralleled for ground return, providing a robust low-impedance power connection.\nJ2 (RTD Channel A) — Breaks out the four-wire RTD_A interface. The pinout maps IDAC (pin 1), IDACRTN (pin 2), RTD_P (pin 3), and RTD_N (pin 4), matching standard four-wire RTD cable assemblies.\nJ3 (RTD Channel B) — Identical pinout to J2 for RTD_B, enabling the second independent temperature measurement channel.\nPCB Design # Layer Stackup # The board is a 2-layer design in order to reduce cost (and also practice wiring on limited dimensions).\nLayer Function Top Signal routing, component placement Bottom Ground plane, secondary routing A solid ground plane on the bottom layer provides low-impedance return paths and reduces electromagnetic interference.\nLayout Strategy # The PCB layout follows a modular placement strategy aligned with the signal flow:\nPower input and protection — Top-left side of the board, near the 24V connector Buck converter and Power — Tight layout with wide traces between IC, inductor, and capacitors to minimize switching loop area MCU — Center of the board, with decoupling capacitors placed directly adjacent to each VDD pin ADC — Near the MCU to keep SPI traces short, with analog input traces routed away from digital switching noise. AGND plane isolated from digital GND with single-point 0Ω bridge Sensor connectors — Board edge for easy cable access SWD/JTAG header — Board edge for programming access Design Rules # Parameter Value Minimum trace width 0.203mm (8mil) Minimum clearance 0.254mm (10mil) Via hole size 0.3mm Via pad size 0.6mm Power trace width ≥0.5mm (20mil) ERC and Design Review # The schematic passed Electrical Rules Check (ERC) with all errors resolved. Key issues encountered during the review process included:\nUnconnected power pins on the MCU requiring explicit no-connect markers Net label mismatches between hierarchical sheets Missing decoupling capacitors flagged by team reviewers The design went through multiple team review iterations on Altium 365, incorporating feedback on component selection, layout spacing, and trace routing.\nTools \u0026amp; Skills # Altium Designer Altium 365 STM32CubeIDE SPI Protocol Hierarchical Schematic Design Buck Converter Design Split Power Domain / Star Ground 4-Wire RTD Measurement ERC / DRC What I Learned # This onboarding project was my transition from LCEDA (EasyEDA) to the Altium Designer ecosystem. The biggest adjustments were the hierarchical schematic structure (four sheets managed by a top-level sheet with inter-sheet connectors), the netlist synchronization workflow (ECO process), manual symbol-footprint-3D model association for each component, and the more complex layer management system.\nDesigning a complete power chain from 24V down to 3.3V using the MAX17503 switching regulator — including fuse protection, TVS clamping, and GND/CGND isolation — was a significant step up from my previous projects, which typically started from USB 5V or battery power. Learning to read and implement a datasheet reference design (selecting feedback resistors for target output voltage, sizing the bootstrap and soft-start capacitors, choosing the power inductor) was a core skill I developed through this project.\nThe analog design aspects were equally valuable. Implementing split power domains (3.3V digital / 5V LDO analog) for the ADS114S06, designing the AGND-to-GND single-point star ground topology with a 0Ω bridge resistor, and adding 47Ω series resistors on every SPI line for signal integrity taught me how precision analog circuits require fundamentally different design practices than pure digital systems. Understanding the four-wire RTD measurement architecture — how IDAC excitation, ratiometric referencing, and RC input filtering work together to achieve high-accuracy temperature measurement — deepened my appreciation for the interplay between circuit design and measurement theory.\nNext Steps # Following completion of this onboarding board, I entered the YJSP HITL department, where the scope expanded to include:\n4-layer PCB design with dedicated power and ground planes LMR36015-based 24V→6V buck converter with INA228 current monitoring PCF8575 GPIO expansion driving ULN2803A relay arrays for valve control Multi-rail power distribution with separated AGND/GND/CGND domains and ferrite bead isolation Reference # STM32H573RI Datasheet MAX17503 Datasheet ADS114S0x Datasheet Four-Wire PT100 RTD Measurement Circuit with Low Side Reference A Basic Guide to RTD Measurements ","date":"May 1, 2026","externalUrl":null,"permalink":"/projects/yjsp-onboarding/","section":"Projects","summary":" Design of STM32 Dual Channel High Precision RTD Temperature Acquisition system for rocket hardware-in-the-loop (HITL) testing. Overview # This project is part of the Yellow Jacket Space Program (YJSP) Avionics Department onboarding program. The goal is to design a 2-layer rapid test board that integrates an STM32H573 microcontroller with an ADS114S06 high-precision ADC for four-wire PT100 RTD temperature measurement, along with a complete power regulation chain from a 24V input.\n","title":"Yellow Jacket Space Program: Avionics Onboarding","type":"projects"},{"content":"","date":"2026年5月1日","externalUrl":null,"permalink":"/zh/tags/%E5%B5%8C%E5%85%A5%E5%BC%8F%E7%B3%BB%E7%BB%9F/","section":"Tags","summary":"","title":"嵌入式系统","type":"tags"},{"content":"","date":"2026年5月1日","externalUrl":null,"permalink":"/zh/tags/%E7%A1%AC%E4%BB%B6/","section":"Tags","summary":"","title":"硬件","type":"tags"},{"content":"","date":"Apr 18, 2026","externalUrl":null,"permalink":"/tags/3d-printing/","section":"Tags","summary":"","title":"3D Printing","type":"tags"},{"content":"","date":"2026年4月18日","externalUrl":null,"permalink":"/zh/tags/3d-%E6%89%93%E5%8D%B0/","section":"Tags","summary":"","title":"3D 打印","type":"tags"},{"content":"","date":"Apr 18, 2026","externalUrl":null,"permalink":"/tags/ble/","section":"Tags","summary":"","title":"BLE","type":"tags"},{"content":" A hardware media control module — designed and built as part of ECE 1100. purticra/ESPKeyboard A compact, wireless media controller built with an ESP32 and BLE HID keyboard emulation. Designed and built as part of Georgia Tech\u0026rsquo;s ECE 1100 Discovery Project. C\u0026#43;\u0026#43; 0 0 Overview # Georgia Tech is known for its intensive, career-oriented curriculum — and keeping pace with the Institute demands real adjustment. For first-year students in the ECE department, ECE 1100 serves as that entry point: a course designed to ease the transition by guiding us through campus exploration and early career planning.\nThis page documents one of those exploration tasks — the Discovery Project.\nProject Roadmap # Initial Planning # The Discovery Project centers on designing and building a Unicode Keyboard — a custom input device that lets users type hexadecimal Unicode values directly to insert special symbols into a computer. The build is based on an Arduino board acting as a USB HID keyboard, paired with a 1602 LCD for real-time input feedback, physical buttons for hex entry, and a 3D-printed enclosure.\nKey resources include the Arduino Keyboard library for USB HID functionality, Georgia Tech\u0026rsquo;s Hive makerspace for 3D printing and prototyping, and the Senior Design Lab for materials and assembly guidance.\nThrough this project, I aim to develop hands-on ECE skills in soldering, embedded programming, system-level debugging, and 3D modeling.\nFeasibility Check \u0026amp; Revised Plan # After initial research, I discovered that true Unicode input via a custom keyboard requires a companion \u0026ldquo;input method\u0026rdquo; application running on the host machine. This approach proved overly complex, as it involves bypassing the standard HID keyboard security protocol. As a result, I decided to pivot the project goal toward something achievable within the standard HID keyboard specification. Given the constraints on time and available tools, the revised project focuses on building a Media Control Module — using an ESP32 and tactile buttons to send standard HID media key commands (play, pause, volume, skip) to a connected computer.\nProject Overview # Hardware Design # The Media Control Module differs from a conventional keyboard in form factor. To take advantage of the ESP32\u0026rsquo;s compact size, the entire device measures roughly 70 × 40 × 45 mm — small enough to fit comfortably in one hand. The top face features three tactile buttons for pause, previous track, and next track, while the control electronics are housed inside the 3D-printed enclosure.\nThe rendered Media Control Module Electrical Connections # The ESP32 serves as the central controller, powered via its Micro-USB port. Three momentary push buttons are connected to GPIO 13, 12, and 14 for play/pause, next track, and previous track respectively. All inputs use the ESP32\u0026rsquo;s internal pull-up resistors, so each button pin is wired directly to ground on the other side — no external resistors needed. The device communicates with the host machine wirelessly over Bluetooth Low Energy (BLE).\nSimplified wiring diagram:\ngraph LR USB[Micro-USB 5V] ==\u003e ESP32[ESP32] subgraph Buttons direction TB B1[Play/Pause\nGPIO 13] B2[Next Track\nGPIO 12] B3[Prev Track\nGPIO 14] end B1 --- ESP32 B2 --- ESP32 B3 --- ESP32 ESP32 -. BLE .-\u003e HOST[Host Machine] Firmware # The firmware is built on the ESP32-BLE-Keyboard library, which allows the ESP32 to appear as a standard Bluetooth HID keyboard to the host machine. On boot, the device advertises itself as \u0026ldquo;MediaPad\u0026rdquo; and waits for a BLE connection.\nOnce paired, the main loop continuously polls the three button inputs. Each button uses active-low logic with the ESP32\u0026rsquo;s internal pull-up resistors — when pressed, the pin is pulled to ground, triggering the corresponding HID media key command: play/pause (GPIO 13), next track (GPIO 12), or previous track (GPIO 14). A 300 ms debounce delay follows each key press to prevent duplicate inputs.\nResult # The finished Media Control Module Media Control Module Loading 3D model… The completed Media Control Module successfully pairs with a host machine over BLE and sends play/pause, next track, and previous track commands with reliable input response. Through this project, I gained hands-on experience in embedded programming with the ESP32, 3D modeling an enclosure in Fusion 360, and iterative hardware debugging — from the initial Unicode keyboard concept to a functional, pocket-sized media controller.\n","date":"Apr 18, 2026","externalUrl":null,"permalink":"/projects/ece-1100-media-control/","section":"Projects","summary":" A hardware media control module — designed and built as part of ECE 1100. purticra/ESPKeyboard A compact, wireless media controller built with an ESP32 and BLE HID keyboard emulation. Designed and built as part of Georgia Tech’s ECE 1100 Discovery Project. ","title":"ECE 1100: Media Control Module","type":"projects"},{"content":"","date":"Mar 29, 2026","externalUrl":null,"permalink":"/tags/altium/","section":"Tags","summary":"","title":"Altium","type":"tags"},{"content":"","date":"Mar 29, 2026","externalUrl":null,"permalink":"/tags/avionics/","section":"Tags","summary":"","title":"Avionics","type":"tags"},{"content":"","date":"Mar 29, 2026","externalUrl":null,"permalink":"/series/career/","section":"Series","summary":"","title":"Career","type":"series"},{"content":"I recently joined the Yellow Jacket Space Program (YJSP) — Georgia Tech\u0026rsquo;s student-run rocketry organization working toward launching a liquid-fueled sounding rocket past the Kármán Line.\nWhat is YJSP Avionics? # The Avionics team is responsible for all electronics hardware and software aboard YJSP\u0026rsquo;s vehicles. The team designs, implements, and tests a stack of custom PCBs including the Flight Computer, Engine Controller, Data Acquisition, Flight Sensors, RF telemetry, and Battery Management System. Beyond flight-critical systems, Avionics also plays a key role in integration and testing of the vehicle and its subsystems.\nAltium Designer serves as the backbone for all hardware design — the same tool the team has relied on for years to design the PCBs that track flight data, control propulsion, and deploy recovery systems.\nOnboarding # The onboarding process started with getting access to the YJSP Altium workspace and completing a Rapid Test Board (RTB) design. This was my first time using Altium, though I had prior PCB design experience on other platforms. The board turned out well — both the schematic and layout passed review, and I received positive feedback from my onboarding lead, Pratham Ingale.\nNext step: a presentation on the RTB design, scheduled for late April.\nHardware in the Loop (HITL) # After passing onboarding, I joined the HITL subteam under Responsible Engineer Peijie Liu. Hardware-in-the-Loop testing is critical for verifying that avionics hardware and software behave correctly before they ever fly — simulating real flight conditions while the physical boards are connected in the loop.\nMy current work involves hands-on PCB design tasks in Altium — migrating component libraries, building custom footprints, and iterating on board layouts for the HITL test infrastructure. The day-to-day has been a deep dive into relay selection, valve driver circuits, connector footprint debugging, and all the gritty details that make a test system reliable.\nLooking forward to contributing more as the team pushes toward its next milestone.\n","date":"Mar 29, 2026","externalUrl":null,"permalink":"/posts/career-progression/yjsp-avionics-hitl/","section":"Posts","summary":"I recently joined the Yellow Jacket Space Program (YJSP) — Georgia Tech’s student-run rocketry organization working toward launching a liquid-fueled sounding rocket past the Kármán Line.\nWhat is YJSP Avionics? # The Avionics team is responsible for all electronics hardware and software aboard YJSP’s vehicles. The team designs, implements, and tests a stack of custom PCBs including the Flight Computer, Engine Controller, Data Acquisition, Flight Sensors, RF telemetry, and Battery Management System. Beyond flight-critical systems, Avionics also plays a key role in integration and testing of the vehicle and its subsystems.\n","title":"Joining YJSP Avionics — Hardware in the Loop","type":"posts"},{"content":"","date":"Mar 29, 2026","externalUrl":null,"permalink":"/posts/","section":"Posts","summary":"","title":"Posts","type":"posts"},{"content":"","date":"Mar 29, 2026","externalUrl":null,"permalink":"/tags/rocketry/","section":"Tags","summary":"","title":"Rocketry","type":"tags"},{"content":"","date":"Mar 29, 2026","externalUrl":null,"permalink":"/series/","section":"Series","summary":"","title":"Series","type":"series"},{"content":"","date":"Mar 29, 2026","externalUrl":null,"permalink":"/tags/yjsp/","section":"Tags","summary":"","title":"YJSP","type":"tags"},{"content":"","date":"2026年3月29日","externalUrl":null,"permalink":"/zh/tags/%E7%81%AB%E7%AE%AD/","section":"Tags","summary":"","title":"火箭","type":"tags"},{"content":"","date":"2026年3月29日","externalUrl":null,"permalink":"/zh/tags/%E8%88%AA%E7%94%B5/","section":"Tags","summary":"","title":"航电","type":"tags"},{"content":"","date":"Feb 15, 2026","externalUrl":null,"permalink":"/tags/fusion-360/","section":"Tags","summary":"","title":"Fusion 360","type":"tags"},{"content":"","date":"Feb 15, 2026","externalUrl":null,"permalink":"/tags/hackathon/","section":"Tags","summary":"","title":"Hackathon","type":"tags"},{"content":"","date":"Feb 15, 2026","externalUrl":null,"permalink":"/tags/mechanical-design/","section":"Tags","summary":"","title":"Mechanical Design","type":"tags"},{"content":"","date":"Feb 15, 2026","externalUrl":null,"permalink":"/series/projects/","section":"Series","summary":"","title":"Projects","type":"series"},{"content":"","date":"Feb 15, 2026","externalUrl":null,"permalink":"/tags/robotics/","section":"Tags","summary":"","title":"Robotics","type":"tags"},{"content":"A 36-hour sprint.\nImmersed in a current of Tough 2000 resin, attitude control, ISO bolts, and bus communication — we turned raw materials into an extraterrestrial rover.\nThe GT IEEE Robotech Hackathon might not be the biggest event, but it was my first real dive into an intensive hackathon-style build. Despite freezing rain and wind, everyone showed up. Our four-member team, TachyAstroach, kicked off the mission.\nThe plan: build a mother-daughter rover system — the \u0026ldquo;mother\u0026rdquo; rover launches the \u0026ldquo;daughter\u0026rdquo; sub-unit, each wirelessly coordinated with custom actuation and ejection mechanisms.\nI led most of the mechanical design using Fusion 360, collaborating with teammates handling electronics, control algorithms, and communication interfaces. (More details available on our DevPost page.)\nWorking with such technically brilliant teammates was pure joy — the kind of trust where you could code and CAD back-to-back without missing a beat.\nExhausting? Absolutely. But deeply rewarding. Fueled by Lidl Diet Cola and a lot of teamwork, we CAD\u0026rsquo;d, cut, soldered, coded, and debugged through the night.\nThe result: a functioning rover prototype and, to our surprise, first place in the competition\u0026rsquo;s track — along with a $1,000 prize.\nCouldn\u0026rsquo;t have done it without Peijie Liu\u0026rsquo;s circuitry magic, Zerun Wang\u0026rsquo;s control logic, and Aimee Yu Ting Zheng\u0026rsquo;s editing wizardry that saved the submission just in time.\nThis project reminded me why I love hands-on prototyping — fast, intense, and immensely fun.\nThis rover really was a blast.\n","date":"Feb 15, 2026","externalUrl":null,"permalink":"/posts/technical-updates/tachyastroach-hackathon/","section":"Posts","summary":"A 36-hour sprint.\nImmersed in a current of Tough 2000 resin, attitude control, ISO bolts, and bus communication — we turned raw materials into an extraterrestrial rover.\nThe GT IEEE Robotech Hackathon might not be the biggest event, but it was my first real dive into an intensive hackathon-style build. Despite freezing rain and wind, everyone showed up. Our four-member team, TachyAstroach, kicked off the mission.\n","title":"TachyAstroach: 36 Hours from Raw Materials to 1st Place Rover","type":"posts"},{"content":" A mother-daughter rover system designed for extraterrestrial exploration built from raw materials in 36 hours at the Georgia Tech IEEE Robotech Hackathon. View on Devpost Overview # TachyAstroach: MoonLine is a mother-daughter rover system where the primary unit launches a secondary sub-unit, with both coordinated wirelessly through custom actuation mechanisms. The project was completed during a 36-hour intensive build at the GT IEEE Robotech Hackathon, transforming raw materials into a functioning extraterrestrial rover prototype.\nMy Role # I led the mechanical design of the rover system using Fusion 360, collaborating closely with teammates on electronics, control algorithms, and communication systems. Throughout the hackathon, we CAD\u0026rsquo;d, cut, soldered, coded, and debugged through the night to bring the rover to life.\nTechnical Details # Design Tool: Fusion 360 for full mechanical design Materials: Tough 2000 resin, ISO bolts Systems: Attitude control systems, bus communication protocols Integration: Mechanical engineering, electronics, and software working in concert to enable wireless coordination between the mother and daughter units Team # Hongyi Lyu Mechanical Design Lead Peijie Liu Electronics Zerun Wang Control Algorithms Aimee Yu Ting Zheng Submission Documentation Result # The prototype won 1st Place in its competition track, earning a $1,000 prize.\n","date":"Feb 15, 2026","externalUrl":null,"permalink":"/projects/tachyastroach/","section":"Projects","summary":" A mother-daughter rover system designed for extraterrestrial exploration built from raw materials in 36 hours at the Georgia Tech IEEE Robotech Hackathon. View on Devpost Overview # TachyAstroach: MoonLine is a mother-daughter rover system where the primary unit launches a secondary sub-unit, with both coordinated wirelessly through custom actuation mechanisms. The project was completed during a 36-hour intensive build at the GT IEEE Robotech Hackathon, transforming raw materials into a functioning extraterrestrial rover prototype.\n","title":"Tachy🪳Astroach: MoonLine","type":"projects"},{"content":"","date":"2026年2月15日","externalUrl":null,"permalink":"/zh/tags/%E6%9C%BA%E5%99%A8%E4%BA%BA/","section":"Tags","summary":"","title":"机器人","type":"tags"},{"content":"","date":"2026年2月15日","externalUrl":null,"permalink":"/zh/tags/%E6%9C%BA%E6%A2%B0%E8%AE%BE%E8%AE%A1/","section":"Tags","summary":"","title":"机械设计","type":"tags"},{"content":"","date":"2026年2月15日","externalUrl":null,"permalink":"/zh/tags/%E9%BB%91%E5%AE%A2%E9%A9%AC%E6%8B%89%E6%9D%BE/","section":"Tags","summary":"","title":"黑客马拉松","type":"tags"},{"content":" Hi, I\u0026rsquo;m Hongyi # I\u0026rsquo;m an Electrical Engineering student at Georgia Tech with a passion for building things that move, sense, and interact with the world around them. Currently maintaining a 4.00 GPA while diving deep into mechatronics and robotics prototyping.\nWhat I Do # My work sits at the intersection of electrical systems, mechanical design, and intelligent control. I enjoy taking ideas from concept to physical prototype, whether that\u0026rsquo;s designing microwave filters in a research lab or building bionic robots that swim across water surfaces.\nI\u0026rsquo;m particularly drawn to projects that require creative problem-solving and rapid iteration. From winning hackathons with moon rover designs to developing imitation learning grippers for manufacturing, I thrive in environments where theory meets hands-on engineering.\nMy Background # Before Georgia Tech, I spent time working on some fascinating projects in China. At Shanghai Huatai Automation, I designed control systems and mechanical structures for robotic grippers. At Ningbo University\u0026rsquo;s Intelligent Wireless Technology Lab, I worked on high-frequency RF circuits and substrate-integrated waveguide filters.\nOne of my most ambitious early projects was designing a bionic frog robot that could maneuver on water surfaces using pneumatic actuators. That project taught me the value of biomimetic design and earned me a spot showcasing at ISEF 2024 in Los Angeles.\nTechnical Toolkit # I work across multiple domains. On the mechanical side, I\u0026rsquo;m comfortable with CAD modeling in Fusion 360, 3D printing, laser cutting, and general fabrication. For electronics, I design PCBs, work with embedded systems, and can navigate everything from oscilloscopes to vector network analyzers.\nMy programming spans C++, Python, and Java, and I\u0026rsquo;ve used tools ranging from Ansys HFSS for electromagnetic simulation to Arduino for rapid prototyping.\nCurrent Focus # Right now, I\u0026rsquo;m involved with Hytech Racing\u0026rsquo;s Electrical Control Department and staying active in the hackathon scene. Recently, my team won first place at the GT IEEE Robotech Hackathon with our MoonLine rover design, where I served as chief mechanical designer.\nI\u0026rsquo;m also working on µCHIMERA, a stackable nano-power generation device that combines piezoelectric elements with smart design for the Inventure Prize 2026.\nWhat\u0026rsquo;s Next # I\u0026rsquo;m seeking internship opportunities in mechatronics and product prototyping for Summer or Fall 2026. I\u0026rsquo;m especially interested in roles that let me work on physical products from initial concept through manufacturing.\nIf you\u0026rsquo;re working on something interesting in robotics, automation, or hardware development, I\u0026rsquo;d love to hear from you.\nLet\u0026rsquo;s Connect # Feel free to reach out at hlyu68@gatech.edu or connect with me on LinkedIn. I\u0026rsquo;m always happy to discuss projects, exchange ideas, or explore collaboration opportunities.\nBased in Atlanta, GA | Speaking Chinese and English\n","date":"Feb 1, 2026","externalUrl":null,"permalink":"/about/","section":"Homepage","summary":"Hi, I’m Hongyi # I’m an Electrical Engineering student at Georgia Tech with a passion for building things that move, sense, and interact with the world around them. Currently maintaining a 4.00 GPA while diving deep into mechatronics and robotics prototyping.\n","title":"About Me","type":"page"},{"content":"","date":"Feb 1, 2026","externalUrl":null,"permalink":"/tags/energy-harvesting/","section":"Tags","summary":"","title":"Energy Harvesting","type":"tags"},{"content":"","date":"Feb 1, 2026","externalUrl":null,"permalink":"/tags/iot/","section":"Tags","summary":"","title":"IoT","type":"tags"},{"content":" No chargers. No cables. No maintenance. What is μCHIMERA? # μCHIMERA (micro Composite Harvesting Integrated Modular Energy Regeneration Array) turns ambient energy into a reliable power supply, so devices can stay on without charging, wires, or maintenance.\nEvery \u0026ldquo;always-on\u0026rdquo; device has the same hidden failure point: not the sensor, not the chip — but the energy supply. The structural inefficiencies of charging infrastructure for industrial systems, wearables, and medical implants cause downtime and safety risks. μCHIMERA eliminates that dependency entirely.\nThe Problem # Current solutions fall short:\nFinite batteries — require scheduled replacement, creating downtime and waste Single-source harvesters — fail when their one energy source is unavailable RF power — fragile, range-limited, and infrastructure-dependent μCHIMERA addresses all three by combining multiple harvesting modalities into one integrated module.\nSystem Architecture # The system integrates three complementary energy harvesting sources into a single modular platform:\nThermal Generator (TEG) # Input Voltage: 20mV ~ 400mV Peak Power: 130μW ~ 53mW Compatible with temperature differences as low as 0.2°C Solar Generator # Input Voltage: 0.12V ~ 5.5V Peak Power: 5μW ~ 510mW with MPPT Optimized for low-light environments Piezoelectric Generator # Input Voltage: 5V ~ 20V AC Peak Power: 88mW RMS Resonant structures designed for random vibration harvesting Energy Storage Module # Max Quiescent Current: 18μA Max Voltage Dropout: 175mV Individual enable \u0026amp; power-good tracking Up to 4 channels, stackable, bidirectional Hardware # The electronics are built around custom PCBs designed by Peijie Liu, featuring the μCHIMERA V1.0a motherboard and stackable daughter boards for each energy harvesting channel.\nKey Features # Versatile \u0026amp; Adaptive — harvests from thermal gradients, light, and vibration simultaneously Safe \u0026amp; Durable — no lithium dependency for primary energy input Infrastructure-Independent — no charging stations, cables, or grid access required Target Markets # Industrial IoT Sensors — eliminate battery swaps and downtime in remote sensor deployments Wearables — no-charging design drives user compliance and enables continuous data collection Medical Devices \u0026amp; Implants — extended longevity reduces costly and risky replacement procedures Market Opportunity # The energy harvesting market is scaling at ~11.6% CAGR, projected to reach ~$1.6B by 2033. Our opportunity: TAM ~$1.6B (2033), SAM ~$216M, and SOM ~$240.7M in the U.S. beachhead by 2028.\nBusiness Model # Hardware modules sold through OEMs, distributors, and direct pilots Starter kit at $129.99 per unit Recurring revenue from add-on harvesting modules at $59.99 each Roadmap # Prototype \u0026amp; Validation — current phase 2026 Design-Partner Pilots — early adopter deployments Paid Deployments — convert pilots to production orders Scale — expand via OEM partnerships and system integrators Impact # By cutting battery waste and enabling always-on devices for health, infrastructure, and sustainable cities, μCHIMERA promotes cleaner energy, safer systems, and lower emissions.\n","date":"Feb 1, 2026","externalUrl":null,"permalink":"/projects/uchimera/","section":"Projects","summary":" No chargers. No cables. No maintenance. What is μCHIMERA? # μCHIMERA (micro Composite Harvesting Integrated Modular Energy Regeneration Array) turns ambient energy into a reliable power supply, so devices can stay on without charging, wires, or maintenance.\n","title":"μCHIMERA","type":"projects"},{"content":"","date":"2026年2月1日","externalUrl":null,"permalink":"/zh/tags/%E7%89%A9%E8%81%94%E7%BD%91/","section":"Tags","summary":"","title":"物联网","type":"tags"},{"content":"","date":"2026年2月1日","externalUrl":null,"permalink":"/zh/tags/%E8%83%BD%E9%87%8F%E9%87%87%E9%9B%86/","section":"Tags","summary":"","title":"能量采集","type":"tags"},{"content":"\rYJSP Avionics Sensor \u0026amp; Valve Controller PCB Feb 2026 – Present Yellow Jacket Space Program — Avionics Hardware Designer Designing a 4-layer PCB for rocket hardware-in-the-loop (HITL) testing using Altium Designer and Altium 365. Integrating STM32H573 MCU with ADS114S06 ADC for four-wire PT100 RTD temperature measurement. Implementing power regulation (24V Buck, LDO), relay driving, INA228 current monitoring, and PCF8575 GPIO expansion.\rYellow Jacket Space Program: Avionics Onboarding May 1, 2026\u0026middot;2330 words ECE Hardware Embedded Systems PCB Design Altium Designer ESP32 Bluetooth Media Control Keypad Mar – Apr 2026 Personal Project Built a pocket-sized BLE HID media controller using ESP32, tactile buttons, rotary encoder, and SSD1306 OLED. Developed firmware for BLE keyboard emulation. Designed and 3D-printed a custom enclosure in Fusion 360. Open-sourced on GitHub.\rECE 1100: Media Control Module Apr 18, 2026\u0026middot;698 words ECE Hardware Embedded Systems BLE 3D Printing GT IEEE Robotech Hackathon — 1st Place Jan 2026 Team TachyAstroach — Chief Mechanical Designer Chief mechanical designer of parent-subunit moon surface rover MoonLine.\rTachy🪳Astroach: MoonLine Feb 15, 2026\u0026middot;197 words Robotics Mechanical Design Hackathon Fusion 360 Inventure Prize 2026 Jan 2026 μCHIMERA: Multimodal Nano-power Gathering Stackable Device Designer of PZT nano-power generating module and overall mechanical designer.\rμCHIMERA Feb 1, 2026\u0026middot;450 words Energy Harvesting PCB Design IoT Hardware Hive Makerspace — Peer Instructor Fall 2026 Georgia Institute of Technology Certified volunteer instructor for 3D printing, laser cutting, and electronic benchtop areas.\rRoboRambler Aug 2025 – Present Georgia Tech RoboMaster Robotics Club — Hardware Designer Hardware department designer (onboarding); contributing to electrical system design for competition robots.\rHytech Racing Aug – Dec 2025 Electrical Control Department — General Electrical Engineer Contributed to electrical systems for Georgia Tech's Formula SAE electric race car.\rGeorgia Institute of Technology Aug 2025 – Present B.S. Electrical Engineering — GPA 4.00 Coursework: Signal Processing (ECE 2026), Circuit Analysis (ECE 2040), Digital Logic Design (ECE 2020), Differential Equations (MATH 2552).\rShanghai Huatai Automation Co., Ltd Jul 2025 Student Intern — Mechanical \u0026amp; Electrical Design Developed an imitation learning gripper. Designed end joint control circuits using LCEDA. Modified mechanical structure in Fusion 360. Manufactured prototype parts via 3D printing.\rNingbo University — SIW Filter Research Jul – Aug 2024 Intern Researcher — Intelligent Wireless Technology Lab Designed and fabricated substrate-integrated waveguide (SIW) microwave bandpass filters. Built prototypes on FR4 and Rogers substrates, optimized using Ansys HFSS. Validated with vector network analyzer.\rBionic Frog Robot Dec 2022 – May 2024 East China Normal University — Student Developer Individual guided project: water-surface robot using pneumatic flexible joint actuators. Built with Fusion 360 modeling, ABAQUS FEA simulation, and Arduino-based wireless control. Showcased at ISEF 2024 in Los Angeles.\rBionic Frog Robot May 1, 2024\u0026middot;407 words Robotics Soft Robotics Pneumatics ISEF Bionic Design ","date":"May 1, 2025","externalUrl":null,"permalink":"/career/","section":"Homepage","summary":"\rYJSP Avionics Sensor \u0026 Valve Controller PCB Feb 2026 – Present Yellow Jacket Space Program — Avionics Hardware Designer Designing a 4-layer PCB for rocket hardware-in-the-loop (HITL) testing using Altium Designer and Altium 365. Integrating STM32H573 MCU with ADS114S06 ADC for four-wire PT100 RTD temperature measurement. Implementing power regulation (24V Buck, LDO), relay driving, INA228 current monitoring, and PCF8575 GPIO expansion.\rYellow Jacket Space Program: Avionics Onboarding May 1, 2026·2330 words ECE Hardware Embedded Systems PCB Design Altium Designer ESP32 Bluetooth Media Control Keypad Mar – Apr 2026 Personal Project Built a pocket-sized BLE HID media controller using ESP32, tactile buttons, rotary encoder, and SSD1306 OLED. Developed firmware for BLE keyboard emulation. Designed and 3D-printed a custom enclosure in Fusion 360. Open-sourced on GitHub.\rECE 1100: Media Control Module Apr 18, 2026·698 words ECE Hardware Embedded Systems BLE 3D Printing GT IEEE Robotech Hackathon — 1st Place Jan 2026 Team TachyAstroach — Chief Mechanical Designer Chief mechanical designer of parent-subunit moon surface rover MoonLine.\rTachy🪳Astroach: MoonLine Feb 15, 2026·197 words Robotics Mechanical Design Hackathon Fusion 360 Inventure Prize 2026 Jan 2026 μCHIMERA: Multimodal Nano-power Gathering Stackable Device Designer of PZT nano-power generating module and overall mechanical designer.\rμCHIMERA Feb 1, 2026·450 words Energy Harvesting PCB Design IoT Hardware Hive Makerspace — Peer Instructor Fall 2026 Georgia Institute of Technology Certified volunteer instructor for 3D printing, laser cutting, and electronic benchtop areas.\rRoboRambler Aug 2025 – Present Georgia Tech RoboMaster Robotics Club — Hardware Designer Hardware department designer (onboarding); contributing to electrical system design for competition robots.\rHytech Racing Aug – Dec 2025 Electrical Control Department — General Electrical Engineer Contributed to electrical systems for Georgia Tech's Formula SAE electric race car.\rGeorgia Institute of Technology Aug 2025 – Present B.S. Electrical Engineering — GPA 4.00 Coursework: Signal Processing (ECE 2026), Circuit Analysis (ECE 2040), Digital Logic Design (ECE 2020), Differential Equations (MATH 2552).\rShanghai Huatai Automation Co., Ltd Jul 2025 Student Intern — Mechanical \u0026 Electrical Design Developed an imitation learning gripper. Designed end joint control circuits using LCEDA. Modified mechanical structure in Fusion 360. Manufactured prototype parts via 3D printing.\rNingbo University — SIW Filter Research Jul – Aug 2024 Intern Researcher — Intelligent Wireless Technology Lab Designed and fabricated substrate-integrated waveguide (SIW) microwave bandpass filters. Built prototypes on FR4 and Rogers substrates, optimized using Ansys HFSS. Validated with vector network analyzer.\rBionic Frog Robot Dec 2022 – May 2024 East China Normal University — Student Developer Individual guided project: water-surface robot using pneumatic flexible joint actuators. Built with Fusion 360 modeling, ABAQUS FEA simulation, and Arduino-based wireless control. Showcased at ISEF 2024 in Los Angeles.\rBionic Frog Robot May 1, 2024·407 words Robotics Soft Robotics Pneumatics ISEF Bionic Design ","title":"Career","type":"page"},{"content":" Electrical Engineering student with hands-on experience in PCB design, embedded systems, and RF/microwave engineering. Seeking undergraduate research opportunities in electronic design, signal processing, or related areas. View / Download PDF Resume\rExperience Personal Projects Activities Awards Skills Education Vertically Integrated Projects — Interacting with Sound and Space (L42i) # Undergraduate Researcher — BONG Sub-team · Georgia Institute of Technology · Jan 2026 – Present\nContributing to the Mk. III iteration of BONG, a digital brass-inspired instrument developed at the Lab for Interaction and Immersion (L42i), transforming it from a controller interface into a self-contained instrument with onboard synthesis, amplification, and spatial interaction capabilities Designed PCB schematic modifications in EasyEDA, including replacing the analog potentiometer with a rotary encoder and routing corrective wiring for the microphone amplifier stage Prototyped speaker bell enclosures via FDM 3D printing and prepared DXF files for laser-cut stacked-ring plywood fabrication as an alternative manufacturing path Co-authoring a semester paper documenting PCB design practices, bell acoustics research, and manufacturing workflows BONG\rL42i BONG Project Page\rYellow Jacket Space Program — Avionics Department # Avionics Hardware Designer · Georgia Institute of Technology · Aug 2025 – Present\nImplemented a 2-layer avionics PCB onboarding project using Altium Designer, integrated STM32H573 MCU with ADS114S06 ADC for four-wire PT100 RTD temperature measurement Entered Hardware-in-the-Loop (HITL) department as an avionics member. Implemented power regulation (24 V input, Buck converter, LDO), relay driving, INA228 current monitoring, and PCF8575 GPIO expansion Iterated schematic and layout through team design reviews; transplanted components for Altium library integration and compatibility YJSP Onboarding Project Page\rShanghai Huatai Automation Co., Ltd # Student Intern — Mechanical \u0026amp; Electrical Design · Shanghai, China · Jul 2025\nDeveloped an imitation learning gripper that provided innovative solutions for traditional manufacturing processes Designed end joint control using LCEDA; completed both \u0026ldquo;pluck wheel\u0026rdquo; and \u0026ldquo;two-stage button\u0026rdquo; configurations Modified mechanical structure in Fusion 360 to accommodate electrical components and improve manual compatibility Designed a modular, lightweight camera bracket for the gripper head in Fusion 360 Manufactured parts via 3D printing and assembled components, ensuring precise fit of screws, bearings, and printed parts Ningbo University — Intelligent Wireless Technology Lab # Intern Researcher · Ningbo, China · Jul 2024 – Aug 2024\nDesigned and fabricated substrate-integrated waveguide (SIW) microwave miniature filters with high Q-factor, low insertion loss Built prototypes on FR4 and Rogers substrates, modeled in Fusion 360, and optimized using Ansys HFSS simulations Validated experimental performance with a vector network analyzer; measured data closely matched simulation results ESP32 Bluetooth Media Control Keypad (ECE Discovery Project) # Personal Project · Mar 2026 – Apr 2026\nBuilt a pocket-sized BLE HID media controller using ESP32, three tactile buttons, rotary encoder, and SSD1306 OLED display Developed firmware for BLE keyboard emulation with play/pause, track skip, volume control, and mute functions Designed and 3D-printed a custom enclosure in Fusion 360; open-sourced code and CAD files on GitHub Media Control Keypad Project Page\rBionic Frog Robot # Student Developer · School of Physics, East China Normal University (ECNU) · Dec 2022 – May 2024\nIndividual guided project to design a water-surface robot using pneumatic flexible joint actuators Built biomimetic robot with Fusion 360 modeling and Arduino-based control Validated wireless sensing and maneuvering performance; showcased project at ISEF 2024 in Los Angeles Bionic Frog Project Page\rHive Makerspace — Peer Instructor # Starting Fall 2026\nCertified volunteer instructor for 3D printing, laser cutting, and electronic benchtop areas.\nRoboRambler — Georgia Tech RoboMaster Robotics Club # Spring 2026 – Present\nEletrical department member contributing to mechanical and electrical system design for competition robots.\nYellow Jacket Space Program — Avionics Department # Aug 2025 – Present\nDesigning avionics PCBs for rocket hardware-in-the-loop (HITL) testing using Altium Designer Developing power regulation circuits and sensor interfacing for embedded flight electronics HyTech Racing — Electrical Control Department # Aug 2025 – Dec 2025\nGeneral Electrical Engineer.\nGT IEEE Robotech Hackathon — First Place Winner # Team TachyAstroach · Jan 2026\nChief mechanical designer of parent-subunit moon surface rover MoonLine.\nMoonLine Project Page\rInventure Prize 2026 — µCHIMERA # Multimodal Nano-power Gathering Stackable Device · Jan 2026\nDesigner of PZT nano-power generating module \u0026amp; overall mechanical designer.\nμChimera Project Page\rManufacture\n3D Printing Silicone Modeling Circuit Soldering Laser Cutting Mechanical Assembly Instrumentation\nVector Network Analyzer Oscilloscope Electronics\nPCB Design (Altium Designer, LCEDA) Embedded Systems (STM32, Arduino) Ansys HFSS Digital Design\nAutodesk Fusion 360 SIMULIA Abaqus FEA Programming\nC++ Python Java MATLAB Languages\nNative Chinese Fluent English Georgia Institute of Technology # Bachelor of Science in Electrical Engineering · Atlanta, GA · Aug 2025 – Present\nGPA: 4.00 Expected Graduation: Dec 2028 ","date":"Feb 1, 2025","externalUrl":null,"permalink":"/resume/","section":"Homepage","summary":" Electrical Engineering student with hands-on experience in PCB design, embedded systems, and RF/microwave engineering. Seeking undergraduate research opportunities in electronic design, signal processing, or related areas. View / Download PDF Resume\r","title":"Resume","type":"page"},{"content":"","date":"May 1, 2024","externalUrl":null,"permalink":"/tags/bionic-design/","section":"Tags","summary":"","title":"Bionic Design","type":"tags"},{"content":" Another Way to Swim: A Lightweight Bionic Frog Robot Based on Pneumatic System Overview # This project presents a lightweight bionic frog robot driven by compressed gas through pneumatic soft-body actuators. Designed to mimic the swimming motion of a frog, the robot operates on the water surface using inchworm-shaped silicone joints that deform under internal air pressure — generating propulsion and enabling directional control.\nThe project was presented at the Regeneron International Science and Engineering Fair (ISEF) 2024 in Los Angeles as part of the China national team delegation, under Project ID ROBO029 in the Robotics and Intelligent Machines category.\nResearch Motivation # Water-floating robots with surface maneuverability can serve as effective platforms for aquatic research, environmental monitoring, and water sampling. Unlike rigid-bodied underwater robots, soft-body pneumatic actuators offer:\nCompliance — safe interaction with aquatic environments Lightweight construction — suitable for surface operation Biomimetic locomotion — efficient swimming gait inspired by real frogs System Architecture # The robot consists of two main subsystems: a control module housed in the main body and a motion module distributed across the four limbs.\nPneumatic System # Dual air pumps (large + small) feed pressurized air through storage syringes 5 solenoid valves independently control four limb joints and one sampling cavity Pneumatic lines route through the body to each silicone soft-body joint Controller board manages valve sequencing for coordinated swimming gaits Soft-Body Actuators # Gen 5 silicone soft-body joints — inchworm-shaped pneumatic actuators Multi-layer construction with embedded constraints for controlled deformation Louvered flipper design for asymmetric drag (power stroke vs. recovery stroke) Went through multiple design iterations with soft-body simulation, component testing, and full machine validation Electronics \u0026amp; Control # Low-power ESP32-based control board Bluetooth connectivity for wireless operation via smartphone Expansion board kit for sensor integration Solenoid valve actuation timing controlled via firmware Swimming Performance # The robot achieves a static water movement speed of approximately 0.04 m/s through coordinated limb actuation. Direction control is realized by differential timing of left and right limb strokes.\nQuad Chart # Key Results # Successfully verified the robot\u0026rsquo;s ability to maneuver on the water surface Capable of carrying a sampling tube for water data collection Wireless control via Bluetooth smartphone interface Sensor data reporting through onboard telemetry Future Goals # Improve motion performance through refined soft-body joint geometry Optimize the resilient structure for greater water-surface compliance Expand commercial and educational platform potential Participate in further surface water robotics research ISEF Display Board # ","date":"May 1, 2024","externalUrl":null,"permalink":"/projects/frog/","section":"Projects","summary":" Another Way to Swim: A Lightweight Bionic Frog Robot Based on Pneumatic System Overview # This project presents a lightweight bionic frog robot driven by compressed gas through pneumatic soft-body actuators. Designed to mimic the swimming motion of a frog, the robot operates on the water surface using inchworm-shaped silicone joints that deform under internal air pressure — generating propulsion and enabling directional control.\n","title":"Bionic Frog Robot","type":"projects"},{"content":"","date":"May 1, 2024","externalUrl":null,"permalink":"/tags/isef/","section":"Tags","summary":"","title":"ISEF","type":"tags"},{"content":"","date":"May 1, 2024","externalUrl":null,"permalink":"/tags/pneumatics/","section":"Tags","summary":"","title":"Pneumatics","type":"tags"},{"content":"","date":"May 1, 2024","externalUrl":null,"permalink":"/tags/soft-robotics/","section":"Tags","summary":"","title":"Soft Robotics","type":"tags"},{"content":"","date":"2024年5月1日","externalUrl":null,"permalink":"/zh/tags/%E4%BB%BF%E7%94%9F%E8%AE%BE%E8%AE%A1/","section":"Tags","summary":"","title":"仿生设计","type":"tags"},{"content":"","date":"2024年5月1日","externalUrl":null,"permalink":"/zh/tags/%E6%B0%94%E5%8A%A8/","section":"Tags","summary":"","title":"气动","type":"tags"},{"content":"","date":"2024年5月1日","externalUrl":null,"permalink":"/zh/tags/%E8%BD%AF%E4%BD%93%E6%9C%BA%E5%99%A8%E4%BA%BA/","section":"Tags","summary":"","title":"软体机器人","type":"tags"},{"content":"","externalUrl":null,"permalink":"/authors/","section":"Authors","summary":"","title":"Authors","type":"authors"},{"content":"","externalUrl":null,"permalink":"/categories/","section":"Categories","summary":"","title":"Categories","type":"categories"},{"content":"","externalUrl":null,"permalink":"/positions/","section":"Positions","summary":"","title":"Positions","type":"positions"},{"content":"","externalUrl":null,"permalink":"/skills/","section":"Skills","summary":"","title":"Skills","type":"skills"}]